Microelectronics Packaging Handbook by Tummala Rymaszewski (49 results)
- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
£ 11.21
£ 2.82 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Microelectronics Packaging Handbook Pt. III : Subsystem Packaging
Klopfenstein, Alan G., Rymaszewski, Eugene J., Tummala, Rao R.
- Hardcover
Seller: Better World Books: West, Reno, NV, U.S.A.Better World Books: West
Contact seller5-star sellerCondition: Used - Good
£ 16.85
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
- More images
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.Goodwill of Silicon Valley
Contact seller5-star sellerCondition: Used - Good
£ 14.32
£ 3.00 shippingShips within U.S.A.Quantity: 1 available
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.
- More images
- Hardcover
Seller: WeBuyBooks, Rossendale, LANCS, United KingdomWeBuyBooks
Contact seller5-star sellerCondition: Used - Good
£ 21.38
£ 14.21 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to… the page edges/pages . Previous owners name inside the front page/cover.
Microelectronics Packaging Handbook: Semiconductor Packaging
Tummala, R. R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Softcover
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.ThriftBooks-Dallas
Contact seller5-star sellerCondition: Used - Good
£ 43.56
Free ShippingShips within U.S.A.Quantity: 1 available
Paperback. Condition: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
Contact seller5-star sellerCondition: Used - Near fine
£ 32.06
£ 11.13 shippingShips from Spain to U.S.A.Quantity: 1 available
Condition: Muy bueno. : Este exhaustivo manual de tres volúmenes, revisado y actualizado, sigue siendo la referencia estándar en el campo de la microelectrónica. Ofrece lo último en métodos de diseño, herramientas de modelado, técnicas de simulación y procedimientos de fabricación. A diferencia de otros libros que se centran sol…o en algunos aspectos del embalaje de microelectrónica, esta obra analiza los paquetes de última generación que cumplen con los requisitos de potencia, refrigeración, protección e interconexión de circuitos cada vez más densos y rápidos. Con un excelente equilibrio entre teoría y aplicaciones prácticas, esta dinámica recopilación presenta ejemplos paso a paso y datos técnicos vitales, simplificando cada fase del diseño y la producción de paquetes. Además, los volúmenes contienen más de 2000 referencias, 900 figuras y 250 tablas. EAN: 9780412084515 Tipo: Libros Categoría: Tecnología Título: Microelectronics Packaging Handbook Autor: Rao Tummala| Eugene J. Rymaszewski| Alan G. Klopfenstein Idioma: en Páginas: 662.
- Hardcover
Seller: BookDepart, Shepherdstown, WV, U.S.A.BookDepart
Contact seller5-star sellerCondition: Used - Very good
£ 39.55
£ 6.35 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on e xterior bottom page edge; former owner's name blacked out at top of exterio r page edge; former owner's name written on front end page; otherwise in ve ry good condition with clean text, firm binding. Dust jacket, ligh…t fading, light shelf wear.
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Cornerstone Books, Villa Park, IL, U.S.A.Cornerstone Books
Contact seller5-star sellerCondition: Used - Very good
£ 50.10
£ 3.39 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Very Good. 2nd. Minimal wear.
- Hardcover
Seller: Books From California, Simi Valley, CA, U.S.A.Books From California
Contact seller4-star sellerCondition: Used - Very good
£ 56.52
£ 3.76 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. The copy shows minor external wear, but is in otherwise clean condition.
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (ed)
- Hardcover
Seller: Moe's Books, Berkeley, CA, U.S.A.Moe's Books
Contact seller4-star sellerCondition: Used - Good
£ 77.52
£ 4.89 shippingShips within U.S.A.Quantity: 1 available
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
£ 106.54
£ 5.23 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contact seller5-star sellerCondition: New
£ 113.53
Free ShippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: new.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
£ 113.53
£ 5.23 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 137.84
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- More images
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 154.54
£ 1.99 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
£ 156.60
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 137.83
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
£ 176.11
£ 8.14 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, bio…graphy. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100. . 1997. 2nd ed. 1997. Hardback. . . . .
- More images
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 159.74
£ 41.98 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
- More images
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 184.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- More images
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 189.03
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III (Pt. 1)
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 177.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 189.04
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 189.04
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- More images
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 211.89
£ 1.99 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- More images
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 212.52
£ 1.99 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
£ 217.39
£ 7.90 shippingShips within U.S.A.Quantity: 15 available
Condition: New. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, bio…graphy. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100. . 1997. 2nd ed. 1997. Hardback. . . . . Books ship from the US and Ireland.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 248.93
£ 3.00 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 752.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 249.39
£ 3.00 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 752 2nd Edition.
- More images
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 217.95
£ 41.98 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kon.
