Rymaszewski E J (11 results)
- Hardcover
Seller: WeBuyBooks, Rossendale, LANCS, United KingdomWeBuyBooks
Contact seller5-star sellerCondition: Used - Good
£ 3.59
£ 14.21 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Condition: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to… the page edges/pages . Previous owners name inside the front page/cover.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 155.00
£ 1.99 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 137.83
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
£ 177.26
£ 9.06 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, bio…graphy. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100. . 1997. 2nd ed. 1997. Hardback. . . . .
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 182.51
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 206.89
£ 1.99 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
£ 218.04
£ 7.93 shippingShips within U.S.A.Quantity: 15 available
Condition: New. Provides information on microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. This three volume set discusses packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Num Pages: 628 pages, bio…graphy. BIC Classification: GBC; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 36. Weight in Grams: 1100. . 1997. 2nd ed. 1997. Hardback. . . . . Books ship from the US and Ireland.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 211.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 239.38
£ 1.99 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 285.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 318.25
£ 1.99 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
