Microelectronics Packaging Handbook: Subsystem Packaging Part III (Pt. 1)

Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.

ISBN 10: 0412084511 ISBN 13: 9780412084515
Published by Springer, 1997
Language: English
Condition: Used - As new Hardcover

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