Microelectronics Packaging Handbook: Subsystem Packaging Part III

Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.

ISBN 10: 0412084511 ISBN 13: 9780412084515
Published by Springer, 1997
Language: English
Condition: New Hardcover

Sold by BennettBooksLtd, San Diego, NV, U.S.A.

AbeBooks Seller since 17 April 2008

Seller rating 5 out of 5 stars 5-star rating, Learn more about seller ratings

View this seller's items


New - Hardcover

Condition: New

Price:
£ 107.55
£ 5.28 shipping within U.S.A.

Quantity: 1 available

Add to basket