Microelectronics Packaging Handbook: Subsystem Packaging Part III

Language: English

Published by Springer US, 1997

0412084511 / 9780412084515

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Seller: moluna, Greven, Germanymoluna

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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.

Seller Inventory # 458434009

Title
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Author
R.R. Tummala|Eugene J. Rymaszewski|Alan G. Klopfenstein
Publisher
Springer US
Publication year
1997
Condition
New
Binding
Hardcover
Language
English
ISBN 10
0412084511
ISBN 13
9780412084515
Edition
2nd Edition

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item26 to 60 business days26 to 60 business days
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Moluna GmbH

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Greven, Germany 48268