Hardcover. Condition: Very Good. This book is in very good condition; no remainder marks. It does have some cover shelfwear. Some scraping inside front cover from removal of a stubborn book plate. Inside pages are clean. ; The Springer International Series In Engineering And Computer Science, 494; 268 pages.
Condition: Very Good. Item in very good condition! Textbooks may not include supplemental items i.e. CDs, access codes etc.
hardcover. Condition: Gut. 268 Seiten; 9780412145612.3 Gewicht in Gramm: 1.
hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 136.79
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 136.79
Quantity: Over 20 available
Add to basketCondition: New. In.
Condition: New.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 136.78
Quantity: Over 20 available
Add to basketCondition: New.
Condition: New. pp. 272.
Condition: New. pp. 276.
Condition: New. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Editor(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565. . 1999. 1999th Edition. hardcover. . . . .
Taschenbuch. Condition: Neu. Failure Analysis of Integrated Circuits | Tools and Techniques | Lawrence C. Wagner | Taschenbuch | The Springer International Series in Engineering and Computer Science | xiii | Englisch | 2012 | Springer | EAN 9781461372318 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 199.99
Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
Condition: New. Provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. This book also includes the coverage of the shortcomings, limitations, and strengths of each technique. Editor(s): Wagner, Lawrence C. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 255 pages, biography. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational. Dimension: 235 x 155 x 17. Weight in Grams: 565. . 1999. 1999th Edition. hardcover. . . . . Books ship from the US and Ireland.
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Condition: As New. Unread book in perfect condition.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Paperback. Condition: Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer US Jan 1999, 1999
ISBN 10: 0412145618 ISBN 13: 9780412145612
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 276 pp. Englisch.
Language: English
Published by Springer US Nov 2012, 2012
ISBN 10: 1461372313 ISBN 13: 9781461372318
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 272 pp. Englisch.
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa.
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This must have reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical fa.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 272 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 276 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Buch. Condition: Neu. Failure Analysis of Integrated Circuits | Tools and Techniques | Lawrence C. Wagner | Buch | The Springer International Series in Engineering and Computer Science | xiii | Englisch | 1999 | Springer | EAN 9780412145612 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 272.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 276.
Language: English
Published by Springer, Springer Jan 1999, 1999
ISBN 10: 0412145618 ISBN 13: 9780412145612
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 276 pp. Englisch.