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Failure Analysis of Integrated Circuits: Tools and Techniques: 494 (The Springer International Series in Engineering and Computer Science, 494) - Hardcover

 
9780412145612: Failure Analysis of Integrated Circuits: Tools and Techniques: 494 (The Springer International Series in Engineering and Computer Science, 494)

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Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

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Synopsis

"Failure Analysis of Integrated Circuits: Tools and Techniques" provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. "Failure Analysis of Integrated Circuits: Tools and Techniques" is a 'must have' reference work for semiconductor professionals and researchers.

"About this title" may belong to another edition of this title.

  • PublisherSpringer
  • Publication date1999
  • ISBN 10 0412145618
  • ISBN 13 9780412145612
  • BindingHardcover
  • LanguageEnglish
  • Number of pages268
  • EditorWagner Lawrence C.

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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This 'must have' reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. 276 pp. Englisch. Seller Inventory # 9780412145612

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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique. Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers. Seller Inventory # 9780412145612

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