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Tummala R R Rymaszewski Eugene Klopfenstein (35 results)
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Condition: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships USPS Media Mail.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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hardcover. Condition: Very Good. 2nd. Used - Very Good.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Condition: good.
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Condition: Good. Used book that is in clean, average condition without any missing pages.
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Condition: New. pp. 1000 2nd Edition.
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Condition: New. pp. 1000.
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Condition: good.
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hardcover. Condition: Very Good. 2nd. Used - Very Good.
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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Published by Chapman & Hall, New York, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Language: English
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
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Condition: New. pp. 1000.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condition: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 134.29
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: New.
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Condition: New.
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Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
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Condition: New.
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Gebunden. Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
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Microelectronics Packaging Handbook : Subsystem Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 226.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Hardcover. Condition: Like New. Like New. book.
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Gebunden. Condition: New. Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kon.
