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Klopfenstein Alan Rymaszewski Eugene Tummala (40 results)
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Condition: good.
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Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1)
Seller: Books From California, Simi Valley, CA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Condition: Very Good. The copy shows minor external wear, but is in otherwise clean condition.
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Condition: New. pp. 1000 2nd Edition.
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Condition: good.
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Condition: New. pp. 1000.
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hardcover. Condition: Very Good. 2nd. Minimal wear.
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Condition: New. pp. 1000.
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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Language: English
Published by Chapman & Hall, New York, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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hardcover. Condition: new.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 137.83
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Microelectronics Packaging Handbook : Technology Drivers
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 181.68
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Gebunden. Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
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Microelectronics Packaging Handbook: Technology Drivers Part I
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 189.04
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Microelectronics Packaging Handbook: Technology Drivers Part I
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 189.04
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 211.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: As New. Unread book in perfect condition.
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Condition: New. pp. 752 2nd Edition.
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Condition: New. pp. 752.
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Gebunden. Condition: New. Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kon.
