Klopfenstein Alan Rymaszewski Eugene Tummala (37 results)
Microelectronics Packaging Handbook Pt. III : Subsystem Packaging
Klopfenstein, Alan G., Rymaszewski, Eugene J., Tummala, Rao R.
- Hardcover
Seller: Better World Books: West, Reno, NV, U.S.A.Better World Books: West
Contact seller5-star sellerCondition: Used - Good
£ 57.53
Free ShippingShips within U.S.A.Quantity: 1 available
Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
- Hardcover
Seller: Books From California, Simi Valley, CA, U.S.A.Books From California
Contact seller4-star sellerCondition: Used - Very good
£ 56.46
£ 3.75 shippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: Very Good. The copy shows minor external wear, but is in otherwise clean condition.
Microelectronics Packaging Handbook, Vols. 1-3
Alan G. Klopfenstein Eugene J. Rymaszewski Rao Tummala R.R. Tummala
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 45.86
£ 3.00 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 1000 2nd Edition.
Microelectronics Packaging Handbook, Vols. 1-3
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao Tummala R.R.
Seller: Majestic Books, Hounslow, , United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 43.07
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. pp. 1000.
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Cornerstone Books, Villa Park, IL, U.S.A.Cornerstone Books
Contact seller5-star sellerCondition: Used - Very good
£ 69.26
£ 3.38 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Very Good. 2nd. Minimal wear.
Microelectronics Packaging Handbook, Vols. 1-3
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao Tummala R.R.
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 44.77
£ 8.61 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. pp. 1000.
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (ed)
- Hardcover
Seller: Moe's Books, Berkeley, CA, U.S.A.Moe's Books
Contact seller4-star sellerCondition: Used - Good
£ 77.44
£ 4.89 shippingShips within U.S.A.Quantity: 1 available
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
- Hardcover
Seller: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contact seller5-star sellerCondition: Used - Good
£ 82.61
£ 2.82 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.Goodwill of Silicon Valley
Contact seller5-star sellerCondition: Used - Good
£ 85.79
£ 3.00 shippingShips within U.S.A.Quantity: 1 available
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
£ 106.43
£ 5.23 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
£ 113.41
£ 5.23 shippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: New. In shrink wrap. Looks like an interesting title.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contact seller5-star sellerCondition: New
£ 144.53
Free ShippingShips within U.S.A.Quantity: 1 available
hardcover. Condition: new.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 137.84
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 154.38
£ 1.98 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller4-star sellerCondition: New
£ 156.44
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 137.83
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 181.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: moluna, Greven, , Germanymoluna
Contact seller5-star sellerCondition: New
£ 160.81
£ 42.38 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 206.87
£ 1.98 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 189.04
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 189.04
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 211.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook: Subsystem Packaging Part III (Pt. 1)
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 204.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 242.40
£ 1.98 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 249.14
£ 3.00 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 752 2nd Edition.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 250.90
£ 3.00 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 752.
- Hardcover
Seller: moluna, Greven, , Germanymoluna
Contact seller5-star sellerCondition: New
£ 219.40
£ 42.38 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kon.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 285.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Microelectronics Packaging Handbook: Technology Drivers Part I
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 278.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. Like New. book.
Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 318.62
£ 1.98 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
