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Rymaszewski Eugene J (57 results)
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Microelectronics Packaging Handbook
Language: English
Published by Van Nostrand Reinhold, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Hardcover. Condition: UsedVeryGood. Hardback with dust jacket. Light shelf wear to exterior; discard stamp on exterior bottom page edge; former owner's name blacked out at top of exterior page edge; former owner's name written on front end page; otherwise in very good condition with clean text, firm binding. Dust jacket, light fading, light shelf wear.
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Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Microelectronics Packaging Handbook: Technology Drivers Part I (Pt. 1)
Seller: Books From California, Simi Valley, CA, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Condition: Very Good. The copy shows minor external wear, but is in otherwise clean condition.
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Condition: New. pp. 1000 2nd Edition.
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Condition: New. pp. 1000.
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hardcover. Condition: Very Good. 2nd. Minimal wear.
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Condition: New. pp. 1000.
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Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Language: English
Published by Chapman & Hall, New York, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.
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Condition: New.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Thin-Film Capacitors for Packaged Electronics
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 96.88
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Thin-Film Capacitors for Packaged Electronics
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 96.88
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Thin-Film Capacitors for Packaged Electronics
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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Thin-Film Capacitors for Packaged Electronics
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 106.96
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. pp. 180.
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hardcover. Condition: new.
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Taschenbuch. Condition: Neu. Thin-Film Capacitors for Packaged Electronics | Eugene J. Rymaszewski (u. a.) | Taschenbuch | xv | Englisch | 2014 | Springer US | EAN 9781461348085 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Microelectronics Packaging Handbook: Subsystem Packaging Part III
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Thin-Film Capacitors for Packaged Electronics
Language: English
Published by Springer New York, Springer US, 2014
ISBN 10: 1461348080 ISBN 13: 9781461348085
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.
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Thin-Film Capacitors for Packaged Electronics
Language: English
Published by Springer US, Springer US, 2003
ISBN 10: 140207705X ISBN 13: 9781402077050
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),-Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness.
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Condition: New.
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Microelectronics Packaging Handbook : Subsystem Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 137.83
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Microelectronics Packaging Handbook : Technology Drivers
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 181.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Gebunden. Condition: New. This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books.
