Alan Klopfenstein Eugene Rymaszewski Rao (20 results)

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Microelectronics Packaging Handbook Pt. III : Subsystem Packaging
Klopfenstein, Alan G., Rymaszewski, Eugene J., Tummala, Rao R.
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: Better World Books: West, Reno, NV, U.S.A.Better World Books: West
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Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Microelectronics Packaging Handbook
Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
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Condition: Muy bueno. : Este exhaustivo manual de tres volúmenes, revisado y actualizado, sigue siendo la referencia estándar en el campo de la microelectrónica. Ofrece lo último en métodos de diseño, herramientas de modelado, técnicas de simulación y procedimientos de fabricación. A diferencia de otros libros que se centran sol…
Microelectronics Packaging Handbook, Part II: Semiconductor Packaging (Second Edition)
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (ed)
Language: English
Published by Chapman & Hall, New York, 1997
0412084414 / 9780412084416
- Hardcover
Seller: Moe's Books, Berkeley, CA, U.S.A.Moe's Books
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Hard cover. Condition: Good. No jacket. Second edition. Part II only. Small dents along cover board edges. Cover corners are bumped and worn. Spine is slightly shaken, but binding is secure. Previous owner's name in ink on front endpaper, but pages themselves are clean and unmarked.
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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
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Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Microelectronics Packaging Handbook : Subsystem Packaging
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 1997
0412084511 / 9780412084515
- Hardcover
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Microelectronics Packaging Handbook
Alan G. Klopfenstein Eugene J. Rymaszewski Rao Tummala
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
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Condition: New. pp. 752.
Microelectronics Packaging Handbook
Alan G. Klopfenstein Rao Tummala Eugene J. Rymaszewski
Language: English
Published by Springer, 1997
0412084317 / 9780412084317
- Hardcover
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Condition: New. pp. 752 2nd Edition.
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Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Microelectronics Packaging Handbook : Technology Drivers
Tummala, Rao R. (EDT); Rymaszewski, Eugene J. (EDT); Klopfenstein, Alan G. (EDT)
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
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Microelectronics Packaging Handbook, Vols. 1-3
Alan G. Klopfenstein Eugene J. Rymaszewski Rao Tummala R.R. Tummala
Language: English
Published by Springer, 1998
0412085615 / 9780412085611
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Microelectronics Packaging Handbook, Vols. 1-3
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao Tummala R.R.
Language: English
Published by Springer, 1998
0412085615 / 9780412085611
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Microelectronics Packaging Handbook, Vols. 1-3
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao Tummala R.R.
Language: English
Published by Springer, 1998
0412085615 / 9780412085611
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Microelectronics Packaging Handbook
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
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Condition: New. Print on Demand pp. 752 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Microelectronics Packaging Handbook
Klopfenstein Alan G. Tummala Rao Rymaszewski Eugene J.
Language: English
Published by Springer, 1997
0412084317 / 9780412084317
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Condition: New. Print on Demand pp. 752 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Microelectronics Packaging Handbook
Klopfenstein Alan G. Tummala Rao Rymaszewski Eugene J.
Language: English
Published by Springer, 1997
0412084317 / 9780412084317
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Microelectronics Packaging Handbook
Klopfenstein Alan G. Rymaszewski Eugene J. Tummala Rao
Language: English
Published by Springer, 2012
1461368294 / 9781461368298
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Condition: New. PRINT ON DEMAND pp. 752.