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The Erasers: A Novel
Language: English
Published by Grove Press/Grove Press, Inc., New York, 1999
ISBN 10: 0802150861 ISBN 13: 9780802150868
Trade Paperback. Condition: Very Good. John Gall (Cover Design); Alfred Gescheidt/Image Bank (Cover Illustration) (illustrator). Copyright © 1964 by Grove Press, Inc. 256 pp. Solidly and tightly bound copy with moderate external, but minimal internal wear and use. Copy with clean text on crisp and bright pages. Smooth covers. Mildly or minimally shelf worn. Minimal, light or very mild discoloration/browning/tanning or foxing on page edges, not affecting text.
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The Erasers: A Novel
Language: English
Published by Grove Press/Grove Press, Inc., New York, 1999
ISBN 10: 0802150861 ISBN 13: 9780802150868
Trade Paperback. Condition: Very Good. John Gall (Cover Design); Alfred Gescheidt/Image Bank (Cover Illustration) (illustrator). Copyright © 1964 by Grove Press, Inc. 256 pp. Solidly and tightly bound copy with moderate external, but minimal internal wear and use. Copy with crisp and bright pages. Occasional pencil markings and marginalia on text. Smooth covers. Mildly or minimally shelf worn.
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Historische zeitschrift, Sonderheft 7: Italien Im Mittelalter : Neuerscheinungen Von 1959-1975
Published by R. Oldenbourg, Munchen, 1980
Seller: PsychoBabel & Skoob Books, Didcot, United Kingdom
Seller rating 5 out of 5 stars
First Edition
Hardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. First Edition. Library-bound in solid, brown cloth. Gilt titles on spine. Bookplate on FEP; accession stamps. Contents otherwise clean and sound throughout. TPW. Ex Library.
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Die Kleinsignaladmittanz von Lawinenlaufzeitdioden unter Berücksichtigung der Temperaturabhängigkeit. Dissertation.
Published by Aachen, 1973
Seller: Wissenschaftliches Antiquariat Köln Dr. Sebastian Peters UG, Köln, Germany
Seller rating 5 out of 5 stars
Broschur. Condition: gut. VI, 139 S. : mit Abb., 21 cm, Deckblatt mit handschr. Markierungen, Ecke leicht geknickt, Lichtrand, Bibliotheksexemplar. Sprache: deu.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 30.92
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Paperback. Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
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Condition: very good. Gut/Very good: Buch bzw. Schutzumschlag mit wenigen Gebrauchsspuren an Einband, Schutzumschlag oder Seiten. / Describes a book or dust jacket that does show some signs of wear on either the binding, dust jacket or pages.
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Condition: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New. pp. 204.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009 : Volume 1156
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 105.08
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 105.07
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . .
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 125.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009 : Symposium Held April 14-17, 2009, San Francisco, California, U.s.a.
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: As New. Unread book in perfect condition.
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Historische zeitschrift, Sonderheft 7: Italien Im Mittelalter : Neuerscheinungen Von 1959-1975
Published by R. Oldenbourg München,, 1980
23 x 16. VIII, 494 Seiten. Fachmännisch neu eingebunden in Hardcovereinband mit goldgeprägtem Rückentitel. Guter Zustand. Sprache: Deutsch Gewicht in Gramm: 691.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Language: English
Published by Materials Research Society, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New. pp. viii + 189.
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Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156: Symposium Held April 14-17, 2009, . California, U.s.a. (MRS Proceedings)
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Condition: New. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. Editor(s): Gall, Martin; Grill, Alfred; Lacopi, Francesca; Usui, Takamasa; Koike, Junichi. Series: MRS Proceedings. Num Pages: 189 pages, Illustrations. BIC Classification: TGM. Category: (U) Tertiary Education (US: College). Dimension: 228 x 152 x 15. Weight in Grams: 400. . 2009. 1st Edition. hardcover. . . . . Books ship from the US and Ireland.
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Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009
Language: English
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Romantik und Geschichte
Seller: SKULIMA Wiss. Versandbuchhandlung, Westhofen, Germany
Seller rating 5 out of 5 stars
Condition: Neu. Polnisches Paradigma, europäischer Kontext, deutsch-polnische Perspektive. Hrsg. von Alfred Gall, Thomas Grob, Andreas Lawaty und German Ritz. Die Besonderheit der polnischen Romantik beruht nicht zuletzt auf einer besonderen Beziehung von Literatur und Geschichte. Dieser Nexus, der fast alle Aspekte der polnischen Romantik berührt, bildet den Rahmen des Sammelbandes, an dem programmatisch Literaturwissenschaftler und Historiker beteiligt sind. Die zwanzig Beiträge polnischer, deutscher und schweizerischer Autoren lassen sich zu drei Blöcken gruppieren: einem interdisziplinär thematischen zu Nationsbildungsprozessen und Modernisierung (Modernisierung: nation building und imagined community), einem komparatistisch poetologischen zu Imagination, Ironie und Intertextualität (Programmatik zwischen Individualisierung und Totalisierung), und schließlich einem kulturtypologischen und wirkungsgeschichtlichen, der über 'das Andere der Romantik' gefasst wird. 419 Seiten, gebunden (Veröffentlichungen des Nordost-Instituts; Band 8/Harrassowitz Verlag 2007). Statt EUR 38,00. Gewicht: 823 g - Gebunden/Gebundene Ausgabe.
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Germania : Jahrbuch deutscher Belletristik - Erster Jahrgang 1851 (Mit Porträt-Stahlstichvon G. Spitter von Hauenschild)
Language: German
Published by Bremen, Franz Schlöodtmann, 1851
Seller: ACADEMIA Antiquariat an der Universität, Freiburg, Germany
Association Member: BOEV
Seller rating 5 out of 5 stars
First Edition
Leinen. Condition: Gut. 1. Auflage. 471 Seiten dunkelbrauner Band mit Goldtitelprägung, Ganzgoldschnitt und Goldverzierung; Rücken / Deckel gelockert (leicht auszubessern); sonst und insgesamtgutes Exempalr mit Novellen von Max Waldau, Louise von Gall, Heinrich Pröhle, Adolf Sathr, Bernd von Guseck, Alfred Meißner, und Anonymus Sprache: Deutsch Gewicht in Gramm: 1.
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Condition: New. Juedische Leben erzaehlen versammelt Werkstattberichte von Autorinnen und Autoren biographischer Studien, die in jahrelanger, intensiver Beschaeftigung mit den Hinterlassenschaften von Menschen juedischer Herkunft deren Leben erfor.
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Fundraising und Sponsoring : Chance auch für kirchliches Denken und Handeln?
Published by Evangelische Akademie Baden Öffentlichkeitsarbeit
ISBN 10: 3896741136 ISBN 13: 9783896741134
Condition: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.
