Steven J. Koester (22 results)
- Softcover
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.Zubal-Books, Since 1961
Contact seller5-star sellerCondition: Used - Fine
£ 14.35
£ 3.39 shippingShips within U.S.A.Quantity: 1 available
Condition: Fine. 384 pp., paperback, fine. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
- Softcover
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.Zubal-Books, Since 1961
Contact seller5-star sellerCondition: New
£ 21.33
£ 3.39 shippingShips within U.S.A.Quantity: 1 available
Condition: New. 350 pp., paperback, new. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Ephesos: Metropolis of Asia. An Interdisciplinary Approach to Its Archaeology, Religion, and Culture (Harvard Theological Studies)
Helmut Koester, Maria Aurenhammer, Steven J. Friesen, Stefan Karwiese, Dieter Knibbe
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
Contact seller5-star sellerCondition: New
£ 27.89
£ 15.49 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: New.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 32.66
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 357 pages. 8.75x5.75x1.25 inches. In Stock.
Koester, H: Ephesos, Metropolis of Asia - An Interdisciplina
Helmut Koester|Maria Aurenhammer|Steven J. Friesen|Stefan Karwiese|Dieter Knibbe
- Softcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 28.79
£ 41.39 shippingShips from Germany to U.S.A.Quantity: 2 available
Condition: New. This volume brings together studies of Ephesos--a major city in the Greco-Roman period and a primary center for the spread of Christianity into the Western world--by an international array of scholars from the fields of classics, fine arts, history of relig.
Ephesos, Metropolis of Asia: An Interdisciplinary Approach to Its Archaeology, Religion, and Culture (Harvard Theological Studies)
Koester, Helmut [Editor]; Aurenhammer, Maria [Contributor]; Friesen, Steven J. [Contributor]; Karwiese, Stefan [Contributor]; Knibbe, Dieter [Contributor]; Limberis, Vasiliki [Contributor]; Scherrer, Peter [Contributor]; Thomas, Christine [Contributor]; Thur, Hilke [Contributor]; Walters, James [Contributor]; White, L. Michael [Contributor]; Zabehlicky-Scheffenegger, Heinrich [Contributor];
- Softcover
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contact seller5-star sellerCondition: New
£ 70.84
£ 5.24 shippingShips within U.S.A.Quantity: 1 available
paperback. Condition: New. In shrink wrap. Looks like an interesting title.
3D Integration for VLSI Systems
Tan, Chuan Seng (EDT); Chen, Kuan-neng (EDT); Koester, Steven J. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 122.45
£ 1.99 shippingShips within U.S.A.Quantity: 11 available
Condition: As New. Unread book in perfect condition.
3D Integration for VLSI Systems
Tan, Chuan Seng (EDT); Chen, Kuan-neng (EDT); Koester, Steven J. (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 124.71
£ 1.99 shippingShips within U.S.A.Quantity: 11 available
Condition: New.
Language: English
Published by Pan Stanford Publishing Pte Ltd, Singapore, 2011
- Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contact seller5-star sellerCondition: New
£ 126.76
Free ShippingShips within U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 135.03
£ 3.01 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 350.
3D Integration for VLSI Systems
Tan, Chuan Seng (EDT); Chen, Kuan-neng (EDT); Koester, Steven J. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 119.78
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: 11 available
Condition: As New. Unread book in perfect condition.
3D Integration for VLSI Systems
Tan, Chuan Seng (EDT); Chen, Kuan-neng (EDT); Koester, Steven J. (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 134.23
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: 11 available
Condition: New.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
Contact seller5-star sellerCondition: New
£ 157.72
Free ShippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 151.08
£ 11.29 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In English.
- Hardcover
Seller: brandnewtexts4sale, Houston, TX, U.S.A.brandnewtexts4sale
Contact seller5-star sellerCondition: New
£ 194.19
£ 5.27 shippingShips within U.S.A.Quantity: 10 available
Condition: New. BRAND NEW. book.
Language: English
Published by Pan Stanford Publishing Pte Ltd, Singapore, 2011
- Hardcover
Seller: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contact seller5-star sellerCondition: New
£ 186.44
£ 27.91 shippingShips from Australia to U.S.A.Quantity: 1 available
Hardcover. Condition: new. Hardcover. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 130.46
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 3 available
Condition: New. pp. 350 This item is printed on demand.
- Hardcover
- Print on Demand
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
Contact seller5-star sellerCondition: New
£ 139.57
£ 5.02 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
HRD. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
- Print on Demand
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
Contact seller5-star sellerCondition: New
£ 150.32
Free ShippingShips within U.S.A.Quantity: Over 20 available
HRD. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 144.12
£ 8.41 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND pp. 350.
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 113.07
£ 41.39 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Chuan Seng Tan, Kuan-Neng ChenThree-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundament.…
- Hardcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 237.79
£ 29.57 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.…
