3D Integration for VLSI Systems - Hardcover

 
9789814303811: 3D Integration for VLSI Systems
Hardcover
ISBN 10: 981430381X ISBN 13: 9789814303811
Publisher: Jenny Stanford Publishing, 2011

Synopsis

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues.

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About the Author

Chuan Seng Tan, Kuan-Neng Chen

"About this title" may belong to another edition of this title.

Publisher
Jenny Stanford Publishing
Publication date
2011
Language
English
ISBN 10 
981430381X
ISBN 13 
9789814303811
Binding
Hardcover
Edition number
1
Number of pages
378
Editor
Tan Chuan Seng, Chen Kuan-Neng, Koester Steven J.