3D Integration for VLSI Systems (Hardcover)

Language: English

Published by Pan Stanford Publishing Pte Ltd, Singapore, 2011

981430381X / 9789814303811

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Hardcover. Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV. There is a long string of benefits that one can derive from 3D IC implementation such as form factor, density multiplication, improved delay and power, enhanced bandwidth, and heterogeneous integration. This book presents contributions by key researchers in this field, covering motivations, technology platforms, applications, and other design issues. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.

Seller Inventory # 9789814303811

Title
3D Integration for VLSI Systems (Hardcover)
Author
Chuan Seng Tan
Publisher
Pan Stanford Publishing Pte Ltd, Singapore
Publication year
2011
Condition
new
Binding
Hardcover
Language
English
ISBN 10
981430381X
ISBN 13
9789814303811

AussieBookSeller

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AbeBooks seller since June 22, 2007

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The Nile Group Pty Ltd

42 Apex Drive
Truganina, VIC Australia 3029