Language: English
Published by Materials Research Society, 2001
ISBN 10: 155899520X ISBN 13: 9781558995208
Seller: Charles Berry, Bookseller, Lakeport, CA, U.S.A.
Hardcover. Condition: Very Good. Hardcover Materials Research Society volume 612 in VG condition, with a single blemish: the upper corner of the front blank endpaper is clipped and missing. Slight pencil erasure inside the front cover, otherwise unmarked. [2.1 lbs]. Book.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New.
Language: English
Published by Cambridge University Press 6/5/2014, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: BargainBookStores, Grand Rapids, MI, U.S.A.
Paperback or Softback. Condition: New. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612. Book.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: California Books, Miami, FL, U.S.A.
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: California Books, Miami, FL, U.S.A.
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 30.92
Quantity: Over 20 available
Add to basketCondition: New. In.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 31.94
Quantity: Over 20 available
Add to basketCondition: New. In.
Language: English
Published by Cambridge University Press 2014-05, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Chiron Media, Wallingford, United Kingdom
PF. Condition: New.
Language: English
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: Chiron Media, Wallingford, United Kingdom
Paperback. Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: As New. Unread book in perfect condition.
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 422.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condition: new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 1st edition. 614 pages. 9.02x5.98x1.22 inches. In Stock. This item is printed on demand.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 1st edition. 422 pages. 8.90x6.00x1.00 inches. In Stock. This item is printed on demand.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
£ 34.53
Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 422.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
£ 35.47
Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 422.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: CitiRetail, Stevenage, United Kingdom
Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: CitiRetail, Stevenage, United Kingdom
Paperback. Condition: new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Language: English
Published by Cambridge University Press, 2013
ISBN 10: 110741315X ISBN 13: 9781107413153
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.KlappentextThe MRS Symposium Proceeding series is an internationally recognised reference suitable for research.