Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612 (Paperback)

Language: English

Published by Cambridge University Press, Cambridge, 2014

110741315X / 9781107413153

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Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

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Title
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612 (Paperback)
Author
G.S. Oehrlein
Publisher
Cambridge University Press, Cambridge
Publication year
2014
Condition
new
Binding
Paperback
Language
English
ISBN 10
110741315X
ISBN 13
9781107413153

CitiRetail

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