Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics: Volume 612 (MRS Proceedings) - Softcover

Oehrlein, G. S.

 
9781107413153: Materials, Technology and Reliability for Advanced Interconnects and LowK Dielectrics: Volume 612 (MRS Proceedings)
Softcover
ISBN 10: 110741315X ISBN 13: 9781107413153
Publisher: Cambridge University Press, 2014

Synopsis

This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

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Publisher
Cambridge University Press
Publication date
2014
Language
English
ISBN 10 
110741315X
ISBN 13 
9781107413153
Binding
Paperback
Number of pages
612

Other Popular Editions of the Same Title

9781558995208: Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612 (MRS Proceedings)

Featured Edition

ISBN 10:  155899520X ISBN 13:  9781558995208
Publisher: Cambridge University Press, 2001
Hardcover