Materials Technology Reliability Advanced by Oehrlein (18 results)

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Proceedings of Symposium Helt April 23-27, 2000, San Francisco, California U.S.A.
G.S. Oehrlein, K. Maex, Y.-C. Joo, S. Ogawa, J.T. Wetzel, Editors
- Hardcover
Seller: Charles Berry, Bookseller, Lakeport, U.S.A.Charles Berry, Bookseller
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Hardcover. Condition: Very Good. Hardcover Materials Research Society volume 612 in VG condition, with a single blemish: the upper corner of the front blank endpaper is clipped and missing. Slight pencil erasure inside the front cover, otherwise unmarked. [2.1 lbs]. Book.

Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Oehrlein, G. S. (EDT); Maex, K. (EDT); Joo, Y. C. (EDT); Ogawa, S. (EDT); Wetzel, J. T. (EDT)
- Softcover
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- Softcover
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Paperback or Softback. Condition: New. Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612. Book.

- Softcover
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Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Oehrlein, G. S. (EDT); Maex, K. (EDT); Joo, Y. C. (EDT); Ogawa, S. (EDT); Wetzel, J. T. (EDT)
- Softcover
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Condition: As New. Unread book in perfect condition.

- Softcover
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Condition: New. In.

- Softcover
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Paperback. Condition: New.

Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Oehrlein, G. S. (EDT); Maex, K. (EDT); Joo, Y. C. (EDT); Ogawa, S. (EDT); Wetzel, J. T. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
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Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics
Oehrlein, G. S. (EDT); Maex, K. (EDT); Joo, Y. C. (EDT); Ogawa, S. (EDT); Wetzel, J. T. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: As New. Unread book in perfect condition.

- Softcover
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- Softcover
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to pr…otect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.

- Softcover
- Print on Demand
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Paperback. Condition: new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utili…zation of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612
Edited by G. S. Oehrlein , K. Maex , Y. -C. Joo , S. Ogawa , J. T. Wetzel
- Softcover
- Print on Demand
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 1st edition. 614 pages. 9.02x5.98x1.22 inches. In Stock. This item is printed on demand.

- Softcover
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Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.

- Softcover
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Seller: CitiRetail, Stevenage, United KingdomCitiRetail
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£ 37.49
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Paperback. Condition: new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utili…zation of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.

- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.KlappentextThe MRS Symposium Proceeding series is an internationally recognised reference suita…ble for research.

- Softcover
- Print on Demand
Seller: AussieBookSeller, Truganina, AustraliaAussieBookSeller
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Paperback. Condition: new. Paperback. This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utili…zation of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.