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Electromigration Modeling Circuit Layout by Tan Cher (14 results)
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Condition: New. pp. 116.
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Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 50.80
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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PF. Condition: New.
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Electromigration Modeling at Circuit Layout Level
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Electromigration Modeling at Circuit Layout Level
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Paperback. Condition: Brand New. 2013 edition. 112 pages. 9.37x6.14x0.39 inches. In Stock.
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Taschenbuch. Condition: Neu. Electromigration Modeling at Circuit Layout Level | Cher Ming Tan (u. a.) | Taschenbuch | SpringerBriefs in Applied Sciences and Technology | ix | Englisch | 2013 | Springer | EAN 9789814451208 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: new. Questo è un articolo print on demand.
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Condition: New. Print on Demand pp. 116 75 Illus. (2 Col.).
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Condition: New. PRINT ON DEMAND pp. 116.
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Electromigration Modeling at Circuit Layout Level
Language: English
Published by Springer Nature Singapore, 2013
ISBN 10: 9814451207 ISBN 13: 9789814451208
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Highlights a new method which models the interconnects EM reliability in both 3D and circuit layout level Combines Cadence and ANSYS softwares to model interconnect reliability of real 3D circuit made up of complete interconnect structures and surro.
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Electromigration Modeling at Circuit Layout Level
Language: English
Published by Springer, Springer Mai 2013, 2013
ISBN 10: 9814451207 ISBN 13: 9789814451208
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 116 pp. Englisch.
