Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology) - Softcover

Tan, Cher Ming; He, Feifei

 
9789814451208: Electromigration Modeling at Circuit Layout Level (SpringerBriefs in Applied Sciences and Technology)
Softcover
ISBN 10: 9814451207 ISBN 13: 9789814451208
Publisher: Springer, 2013

Synopsis

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

"synopsis" may belong to another edition of this title.

From the Back Cover

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.

"About this title" may belong to another edition of this title.

Publisher
Springer
Publication date
2013
Language
English
ISBN 10 
9814451207
ISBN 13 
9789814451208
Binding
Paperback
Number of pages
112

Other Popular Editions of the Same Title

9789814451222: Electromigration Modeling at Circuit Layout Level

Featured Edition

ISBN 10:  9814451223 ISBN 13:  9789814451222
Publisher: Springer, 2013
Softcover