He Feifei (14 results)
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Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 43.25
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Condition: New.
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Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 50.95
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Condition: As New. Unread book in perfect condition.
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Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 50.80
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
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Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 49.87
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
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Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 66.53
£ 2.99 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 116.
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Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 53.93
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
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Language: English
Published by Albert Whitman & Company, 2019
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Seller: Barely Read Books, Limpsfield, United KingdomBarely Read Books
Contact seller5-star sellerCondition: Used - Fine
£ 45.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Add to basketHardcover. Condition: Fine. Dust Jacket Condition: Fine. reprint. Very clean bright boards no bumps or rubs. Textblocks in red, Book plate with author signature to FEP unopened. Fine. Dust Wrapper Complete no loss tears or rubs as new. Jacket Illustration by Feifei Ruan Design and Interior Illustrations by Ellen Kokontis (illu…strator). Signed by Author(s).
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Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 64.08
£ 10.00 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. 2013 edition. 112 pages. 9.37x6.14x0.39 inches. In Stock.
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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 51.33
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect…levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
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Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
£ 52.74
Free ShippingShips within U.S.A.Quantity: 10 available
Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 47.02
£ 19.63 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number…of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level. 116 pp. Englisch.
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Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 65.89
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 116 75 Illus. (2 Col.).
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Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 68.79
£ 8.49 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND pp. 116.
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Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 42.52
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Highlights a new method which models the interconnects EM reliability in both 3D and circuit layout level Combines Cadence and ANSYS softwares to model interconnect reliability of real 3D circuit made up of complete i…nterconnect structures and surro.
