Electromigration Modeling at Circuit Layout Level

Language: English

Published by Springer, Springer Mai 2013, 2013

9814451207 / 9789814451208

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This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 116 pp. Englisch.

Seller Inventory # 9789814451208

Title
Electromigration Modeling at Circuit Layout Level
Author
Cher Ming Tan
Publisher
Springer, Springer Mai 2013
Publication year
2013
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
9814451207
ISBN 13
9789814451208
Item weight
189 grams
Dimensions
235x155x7 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

5-star seller

AbeBooks seller since January 23, 2017

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