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Design for Test Test Optimization Techniques by Noia Brandon (15 results)
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 94.13
Convert currency£ 11.98 shipping from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing AG, 2013
ISBN 10: 3319023772 ISBN 13: 9783319023779
Language: English
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
£ 132.16
Convert currency£ 9.14 shipping from Ireland to U.S.A.Quantity: 15 available
Add to basketCondition: New. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Num Pages: 263 pages, 18 black & white illustrations, 115 colour illustrations, 23 black & white tables, biogra. BIC Classification: TJFC; TJFD; UYF. Category: (P) Professional & Vocational. Dimension: 243 x 157 x 16. Weight in Grams: 514. . 2013. 2014th Edition. Hardcover. . . . .
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£ 129.50
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 2 available
Add to basketHardcover. Condition: Brand New. 2014 edition. 274 pages. 9.50x6.50x0.75 inches. In Stock.
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Design-for-test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing AG, 2013
ISBN 10: 3319023772 ISBN 13: 9783319023779
Language: English
Condition: New. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs Num Pages: 263 pages, 18 black & white illustrations, 115 colour illustrations, 23 black & white tables, biogra. BIC Classification: TJFC; TJFD; UYF. Category: (P) Professional & Vocational. Dimension: 243 x 157 x 16. Weight in Grams: 514. . 2013. 2014th Edition. Hardcover. . . . . Books ship from the US and Ireland.
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Condition: New. pp. 263.
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£ 146.56
Convert currency£ 25 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketPaperback. Condition: Brand New. reprint edition. 264 pages. 9.25x6.10x0.62 inches. In Stock.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing, 2013
ISBN 10: 3319023772 ISBN 13: 9783319023779
Language: English
£ 80.69
Convert currency£ 42.65 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule opti.
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Published by Springer International Publishing, 2016
ISBN 10: 3319345346 ISBN 13: 9783319345345
Language: English
£ 82.84
Convert currency£ 42.65 shipping from Germany to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICsIncludes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule opti.
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£ 168.80
Convert currency£ 6.50 shipping from United Kingdom to U.S.A.Quantity: 4 available
Add to basketCondition: New. Print on Demand pp. 263.
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£ 184.40
Convert currency£ 8.66 shipping from Germany to U.S.A.Quantity: 4 available
Add to basketCondition: New. PRINT ON DEMAND pp. 263.
