Title: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Publisher: Springer
Publication Date: 2016
Language: English
ISBN 10: 3319345346
ISBN 13: 9783319345345
Binding: Soft cover
Condition: New

About this title

Synopsis

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

About the Author

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.

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