Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Noia, Brandon

ISBN 10: 3319345346 / ISBN 13: 9783319345345

Published by Springer, 2016

About this Item

Print on Demand pp. 263.

Seller Inventory # 385690326

Bibliographic Details

• Title: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
• Publisher: Springer
• Publication Date: 2016
• Language: English
• ISBN 10: 3319345346
• ISBN 13: 9783319345345
• Binding: Soft cover
• Condition: New

About this title

Synopsis

This volume encompasses the latest, innovative methods of testing three-dimensional integrated circuits, incorporating pre-bond and post-bond tests as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.

About the Author

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.