Advanced Manufacturing Techniques Engineering (72 results)

- Hardcover
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- Hardcover
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- Hardcover
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- Hardcover
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Softcover
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Additive Manufacturing Processes in Biomedical Engineering: Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (Editor)/ Sharma, Ankit (Editor)/ Jain, Vivek (Editor)/ Gupta, Dheeraj (Editor)
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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£ 77.97
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Paperback. Condition: Brand New. 242 pages. 9.18x6.12x9.21 inches. In Stock.

- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Language: English
Published by Springer, 2018
Series: Springer Series in Advanced Manufacturing, Book 50 of 74. Book 50 of 74 - Springer Series in Advanced Manufacturing
- Hardcover
Seller: StainesBook, Weybridge, SURRE, United KingdomStainesBook
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Language: English
Published by CRC Press, 2023
Series: Mathematical Engineering, Manufacturing, and Management Sciences, Book 28 of 29. Book 28 of 29 - Mathematical Engineering, Manufacturing, and Management Sciences
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Language: English
Published by CRC Press, 2023
Series: Mathematical Engineering, Manufacturing, and Management Sciences, Book 28 of 29. Book 28 of 29 - Mathematical Engineering, Manufacturing, and Management Sciences
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 154.13
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Condition: New. 1st edition NO-PA16APR2015-KAP.

Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Babbar, Atul (EDT); Sharma, Ankit (EDT); Jain, Vivek (EDT); Gupta, Dheeraj (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Language: English
Published by Springer, 2019
Series: Springer Series in Advanced Manufacturing, Book 50 of 74. Book 50 of 74 - Springer Series in Advanced Manufacturing
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 170.64
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Condition: New. Softcover reprint of the original 1st ed. 2018 edition NO-PA16APR2015-KAP.

Language: English
Published by Springer, 2018
Series: Springer Series in Advanced Manufacturing, Book 50 of 74. Book 50 of 74 - Springer Series in Advanced Manufacturing
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Language: English
Published by CRC Press, 2023
Series: Mathematical Engineering, Manufacturing, and Management Sciences, Book 28 of 29. Book 28 of 29 - Mathematical Engineering, Manufacturing, and Management Sciences
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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Language: English
Published by Springer International Publishing, 2019
Series: Springer Series in Advanced Manufacturing, Book 50 of 74. Book 50 of 74 - Springer Series in Advanced Manufacturing
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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£ 115.68
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Taschenbuch. Condition: Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | viii | Englisch | 2019 | Springer International Publishing | EAN 9783030085612 | Verantwortlich…e Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Advanced Manufacturing Techniques for Engineering and Engineered Materials
Thanigaivelan, R. (EDT); Rajan, N. (EDT); Argul, T. G. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Language: English
Published by Springer International Publishing, Springer International Publishing, 2019
Series: Springer Series in Advanced Manufacturing, Book 50 of 74. Book 50 of 74 - Springer Series in Advanced Manufacturing
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of ben…zocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Language: English
Published by Springer, Berlin, Springer International Publishing, Springer, 2018
Series: Springer Series in Advanced Manufacturing, Book 50 of 74. Book 50 of 74 - Springer Series in Advanced Manufacturing
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 134.41
£ 52.71 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclo…butene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.