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Advanced Manufacturing Techniques Engineering (71 results)
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Condition: As New. Unread book in perfect condition.
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Advanced Techniques for Design and Manufacturing in Marine Engineering
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 42.52
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Advanced Techniques For Design And Manufacturing In Marine Engineering
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Advanced Techniques For Design And Manufacturing In Marine Engineering
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Additive Manufacturing Processes in Biomedical Engineering: Advanced Fabrication Methods and Rapid Tooling Techniques
Language: English
Published by Taylor & Francis Ltd, 2024
ISBN 10: 1032109734 ISBN 13: 9781032109732
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Paperback. Condition: Brand New. 242 pages. 9.18x6.12x9.21 inches. In Stock.
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Additive Manufacturing Processes in Biomedical Engineering: Advanced Fabrication Methods and Rapid Tooling Techniques
Language: English
Published by Taylor & Francis Ltd, 2022
ISBN 10: 1032109726 ISBN 13: 9781032109725
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. New copy - Usually dispatched within 4 working days.
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Condition: New. Softcover reprint of the original 1st ed. 2018 edition NO-PA16APR2015-KAP.
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Additive Manufacturing Processes in Biomedical Engineering : Advanced Fabrication Methods and Rapid Tooling Techniques
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Book 50 of 74: Springer Series in Advanced ManufacturingLanguage: English
Published by Springer International Publishing, 2019
ISBN 10: 3030085619 ISBN 13: 9783030085612
Taschenbuch. Condition: Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | viii | Englisch | 2019 | Springer International Publishing | EAN 9783030085612 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Advanced Manufacturing Techniques for Engineering and Engineered Materials
Language: English
Published by Engineering Science Reference, 2022
ISBN 10: 1799895750 ISBN 13: 9781799895756
Condition: New.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Book 50 of 74: Springer Series in Advanced ManufacturingLanguage: English
Published by Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3030085619 ISBN 13: 9783030085612
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
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Advanced Manufacturing Techniques for Engineering and Engineered Materials (Advances in Chemical and Materials Engineering)
Language: English
Published by Engineering Science Reference, 2022
ISBN 10: 1799895750 ISBN 13: 9781799895756
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 171.34
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Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Book 50 of 74: Springer Series in Advanced ManufacturingLanguage: English
Published by Springer, Berlin, Springer International Publishing, Springer, 2018
ISBN 10: 3319778714 ISBN 13: 9783319778716
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
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Advanced Manufacturing Techniques for Engineering and Engineered Materials
Language: English
Published by Engineering Science Reference, 2022
ISBN 10: 1799895750 ISBN 13: 9781799895756
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 171.33
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
