Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using . (Springer Series in Advanced Manufacturing)

Book 50 of 74: Springer Series in Advanced Manufacturing

Seok, Seonho

ISBN 10: 3319778714 ISBN 13: 9783319778716
Published by Springer, 2018
Language: English
Condition: New Hardcover

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