Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Seonho Seok

ISBN 10: 3030085619 ISBN 13: 9783030085612
Published by Springer International Publishing, Springer International Publishing, 2019
Language: English
Condition: New Soft cover

Sold by AHA-BUCH GmbH, Einbeck, Germany

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New - Soft cover

Condition: New

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