Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Seonho Seok

ISBN 10: 3319778714 ISBN 13: 9783319778716
Published by Springer, Berlin, Springer International Publishing, Springer, 2018
Language: English
Condition: New Hardcover

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New - Hardcover

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