Youngsoo Shin (44 results)

Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.…

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VLSI-SoC: Design for Reliability, Security, and Low Power: 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers (IFIP Advances in Information and Communication Technology)
Shin, Youngsoo (Editor) / Tsui, Chi Ying (Editor) / Kim, Jae-Joon (Editor) / Choi, Kiyoung (Editor) / Reis, Ricardo (Editor)
Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. rep rev edition. 240 pages. 9.25x6.10x0.63 inches. In Stock.

Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.…

- Softcover
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- Softcover
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Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. VLSI-SoC: Design for Reliability, Security, and Low Power | 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised Selected Papers | Youngsoo Shin (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technology | xiii | Englisch | 2018 | Springer | EAN 9783319834405 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

- Softcover
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- Softcover
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- Softcover
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Paperback. Condition: New. This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology. Softcover Reprint of the Original 1st 2018 ed.…

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- Softcover
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Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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- Hardcover
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Condition: New. In English.

Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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- Hardcover
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.…

- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology.…

- Softcover
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Condition: New. pp. 152.

- Softcover
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Condition: New. Introduces a highly promising patterning solution for next generation technologyProvides a comprehensive overview of directed self-assembly lithography (DSAL) friendly physical design and DSAL-aware mask synthesis Written by leading .

- Hardcover
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Paperback. Condition: New. This book discusses physical design and mask synthesis of directed self-assembly lithography (DSAL). It covers the basic background of DSAL technology, physical design optimizations such as placement and redundant via insertion, and DSAL mask synthesis as well as its verification. Directed self-assembly lithography (DSAL) is a highly promising patterning solution in sub-7nm technology. Softcover Reprint of the Original 1st 2018 ed.…

- Softcover
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Language: English
Published by Springer, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
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Language: English
Published by Springer, 2018
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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Language: English
Published by Springer International Publishing Sep 2016, 2016
Series: Book 143 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. 240 pp. Englisch.…