Yan Li Deepak Goyal (38 results)
Language: English
Published by Springer, 2017
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
- First Edition
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Hardcover. Condition: Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, a…n industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
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Condition: New. In.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
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Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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Condition: New.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. 3D Microelectronic Packaging | From Fundamentals to Applications | Yan Li (u. a.) | Taschenbuch | ix | Englisch | 2018 | Springer | EAN 9783319830865 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: pr…eigu.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. 3D Microelectronic Packaging | From Architectures to Applications | Yan Li (u. a.) | Taschenbuch | Springer Series in Advanced Microelectronics | xvii | Englisch | 2021 | Springer | EAN 9789811570926 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juerg…en[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer Verlag, Singapore, SG, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Rarewaves.com USA, London, LONDO, United KingdomRarewaves.com USA
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Hardback. Condition: New. Second Edition 2021. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the… latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Language: English
Published by Springer, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. 2nd ed. 2021 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New.
Language: English
Published by Springer, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 170.14
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides reade…rs an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 172.19
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectr…onic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
Language: English
Published by Springer, Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 179.58
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an i…n-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 241.49
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Condition: New. Softcover reprint of the original 1st ed. 2017 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer Nature, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 2nd edition. 639 pages. 9.25x6.10x1.50 inches. In Stock.
Language: English
Published by Springer Verlag, Singapore, SG, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
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£ 208.03
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Hardback. Condition: New. Second Edition 2021. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the… latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Hardcover. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Language: English
Published by Springer, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
Language: English
Published by Springer, Berlin|Springer Nature Singapore|Springer, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectron…ic packaging.This book off.
Language: English
Published by Springer Singapore, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides comprehensive coverage of 3D microelectronic packages Explains the fundamentals of using solder interconnects as micro-bumps Demonstrates the advanced materials and processes used in 3D microelectro…nic packages Introd.
Language: English
Published by Springer, Springer Nov 2021, 2021
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. I…t provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
Language: English
Published by Springer, Springer Nov 2020, 2020
Series: Book 66 of 72 - Springer Series in Advanced Microelectronics
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provi…des readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. 640 pp. Englisch.
Language: English
Published by Springer International Publishing Jul 2018, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 170.14
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for fu…ture microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 476 pp. Englisch.
