3D Microelectronic Packaging
Language: English
Published by Springer International Publishing Jul 2018, 2018
Series: Book 61 of 72 - Springer Series in Advanced Microelectronics
- Softcover
- New
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
AbeBooks seller since January 11, 2012
Condition: New
£ 170.14
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Add to basketItem description from seller
Seller Inventory # 9783319830865
- Title
- 3D Microelectronic Packaging
- Author
- Deepak Goyal
- Publisher
- Springer International Publishing Jul 2018
- Publication year
- 2018
- Condition
- Neu
- Binding
- Taschenbuch
- Language
- English
- ISBN 10
- 3319830864
- ISBN 13
- 9783319830865
- Item weight
- 715 grams
- Dimensions
- 235x155x26 mm
- Series
- Book 61 of 72: Springer Series in Advanced Microelectronics
"Synopsis" may belong to another edition of this title.
From the Back Cover
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights intokey areas for future research and development.
- Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
- Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design
- Features contributions from both academic and industry authors, for a complete view of this important technology
"About the title" may belong to another edition of this title.
BuchWeltWeit Ludwig Meier e.K.
Bergisch Gladbach, Germany
AbeBooks seller since January 11, 2012
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