Hardcover. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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Condition: New. Softcover reprint of the original 2nd ed. 2019 edition NO-PA16APR2015-KAP.
Condition: New. 2nd ed. 2019 edition NO-PA16APR2015-KAP.
Condition: As New. Unread book in perfect condition.
Condition: New. pp. 770.
Condition: New. pp. 770 1st Edition.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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hardcover. Condition: Very Good.
Condition: New. pp. 770.
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Hardcover. Condition: Brand New. 2nd edition. 282 pages. 9.25x6.25x0.25 inches. In Stock.
Language: English
Published by Springer International Publishing AG, Cham, 2018
ISBN 10: 331983777X ISBN 13: 9783319837772
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condition: new. Paperback. This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Condition: New. 3rd edition NO-PA16APR2015-KAP.
Condition: New.
Condition: New.
Language: English
Published by Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3030094014 ISBN 13: 9783030094010
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with a broad overview of integrated circuits, also generally referred to as micro-electronics. The presentation is designed to be accessible to readers with limited, technical knowledge and coverage includes key aspects of integrated circuit design, implementation, fabrication and application. The author complements his discussion with a large number of diagrams and photographs, in order to reinforce the explanations. The book is divided into two parts, the first of which is specifically developed for people with almost no or little technical knowledge. It presents an overview of the electronic evolution and discusses the similarity between a chip floor plan and a city plan, using metaphors to help explain concepts. It includes a summary of the chip development cycle, some basic definitions and a variety of applications that use integrated circuits. The second part digs deeper into the details and is perfectly suited for professionals working in one of thesemiconductor disciplines who want to broaden their semiconductor horizon.