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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 107.12
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Condition: As New. Unread book in perfect condition.
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3d Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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£ 107.11
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3d Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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3D Interconnect Architectures for Heterogeneous Technologies
Language: English
Published by Springer Nature Switzerland AG, CH, 2022
ISBN 10: 3030982289 ISBN 13: 9783030982287
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
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£ 141.94
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Condition: New. 1st ed. 2022 edition NO-PA16APR2015-KAP.
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Hardcover. Condition: Brand New. 420 pages. 9.25x6.10x0.94 inches. In Stock.
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3D Interconnect Architectures for Heterogeneous Technologies
Language: English
Published by Springer Nature Switzerland AG, CH, 2022
ISBN 10: 3030982289 ISBN 13: 9783030982287
£ 130.28
£ 65 shipping
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Add to basketHardback. Condition: New. 2022 ed.
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Hardcover. Condition: Brand New. 420 pages. 9.25x6.10x0.94 inches. In Stock. This item is printed on demand.
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3D Interconnect Architectures for Heterogeneous Technologies
Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2023
ISBN 10: 3030982319 ISBN 13: 9783030982317
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the ph.
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Interconnect Architectures for 3D Systems-on-Chip with Heterogeneous Technologies
Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2022
ISBN 10: 3030982289 ISBN 13: 9783030982287
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the ph.
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Condition: New. Print on Demand.
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Condition: New. PRINT ON DEMAND.
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Condition: New. Print on Demand.
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Condition: New. PRINT ON DEMAND.
