3D Interconnect Architectures for Heterogeneous Technologies

Language: English

Published by Springer Nature Switzerland AG, CH, 2022

3030982289 / 9783030982287

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This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow's 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

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Title
3D Interconnect Architectures for Heterogeneous Technologies
Author
Lennart Bamberg, Jan Moritz Joseph, Alberto García-Ortiz, Thilo Pionteck
Publisher
Springer Nature Switzerland AG, CH
Publication year
2022
Condition
New
Binding
Hardback
Language
English
ISBN 10
3030982289
ISBN 13
9783030982287
Edition
2022 ed.

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