Language: English
Published by AURIS REFERENCE LIMITED, 2015
ISBN 10: 1781546894 ISBN 13: 9781781546895
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by AURIS REFERENCE LIMITED, 2015
ISBN 10: 1781546894 ISBN 13: 9781781546895
Seller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by AURIS REFERENCE LIMITED, 2015
ISBN 10: 1781546894 ISBN 13: 9781781546895
Seller: Books Puddle, New York, NY, U.S.A.
Condition: Used.
Language: English
Published by AURIS REFERENCE LIMITED, 2015
ISBN 10: 1781546894 ISBN 13: 9781781546895
Seller: Majestic Books, Hounslow, United Kingdom
Condition: Used.
Language: English
Published by AURIS REFERENCE LIMITED, 2015
ISBN 10: 1781546894 ISBN 13: 9781781546895
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: Used.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New.
Seller: INDOO, Avenel, NJ, U.S.A.
Condition: New. Brand New.
Language: English
Published by John Wiley & Sons Inc, New York, 2011
ISBN 10: 047025002X ISBN 13: 9780470250020
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
First Edition
Hardcover. Condition: new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Mass Market Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Condition: New. Brand new! Please provide a physical shipping address.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: New.
Language: English
Published by John Wiley and Sons Ltd, 2011
ISBN 10: 047025002X ISBN 13: 9780470250020
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
First Edition
Condition: New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Connally, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . .
Language: English
Published by John Wiley & Sons Inc, New York, 2011
ISBN 10: 047025002X ISBN 13: 9780470250020
Seller: CitiRetail, Stevenage, United Kingdom
First Edition
Hardcover. Condition: new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Gebunden. Condition: New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: As New. Unread book in perfect condition.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition.
Language: English
Published by John Wiley and Sons Ltd, 2011
ISBN 10: 047025002X ISBN 13: 9780470250020
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Editor(s): Suhir, Ephraim; Yu, T. X.; Steinberg, David S.; Connally, Eric. Num Pages: 608 pages, Illustrations. BIC Classification: TJF. Category: (P) Professional & Vocational. Dimension: 244 x 201 x 36. Weight in Grams: 1180. . 2011. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.
Language: English
Published by John Wiley & Sons Inc, New York, 2011
ISBN 10: 047025002X ISBN 13: 9780470250020
Seller: AussieBookSeller, Truganina, VIC, Australia
First Edition
Hardcover. Condition: new. Hardcover. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice. The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.