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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Volume 2.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
XXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Structural Analysis in Microelectronic and Fiber-optic Systems: Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis: Vol 1
Language: English
Published by Springer Netherlands, 2013
ISBN 10: 9401165378 ISBN 13: 9789401165372
Paperback. Condition: Brand New. 436 pages. 8.98x6.06x1.02 inches. In Stock.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Bioenergy Engineering
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Bioenergy Engineering
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New.
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Hardcover. Condition: Good. Satisfaction 100% guaranteed.
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International EditionCondition: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
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Structural Dynamics of Electronic and Photonic Systems
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Gebunden. Condition: New. Dr. EPHRAIM SUHIR is Fellow of the IEEE, ASME, APS, IoP (UK), and the SPE. He is Foreign Full Member (Academician) of the National Academy of Engineering, Ukraine cofounder of the ASME Journal of Electronic Packaging holds twenty-two U.S. patents and has.
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Structural Dynamics of Electronic and Photonic Systems
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Moisture Sensitivity of Plastic Packages of IC Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 217.77
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: As New. Unread book in perfect condition.
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Condition: New.
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 230
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro- and Opto-Electronic Materials, Structures, and Systems)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 230
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Taschenbuch. Condition: Neu. Moisture Sensitivity of Plastic Packages of IC Devices | X. J. Fan (u. a.) | Taschenbuch | Micro- and Opto-Electronic Materials, Structures, and Systems | xiv | Englisch | 2012 | Springer | EAN 9781461426257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: As New. Unread book in perfect condition.
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Moisture Sensitivity of Plastic Packages of IC Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 254.65
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. pp. 590.
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Moisture Sensitivity of Plastic Packages of IC Devices
Language: English
Published by Springer US, Springer US, 2010
ISBN 10: 1441957189 ISBN 13: 9781441957184
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
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Moisture Sensitivity of Plastic Packages of IC Devices
Language: English
Published by Springer US, Springer US, 2012
ISBN 10: 1461426251 ISBN 13: 9781461426257
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
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Moisture Sensitivity of Plastic Packages of IC Devices (Micro and Opto-electronic Materials, Structures, and Systems)
Language: English
Published by Springer-Verlag New York Inc., 2012
ISBN 10: 1461426251 ISBN 13: 9781461426257
Paperback. Condition: Brand New. 572 pages. 9.20x6.10x1.33 inches. In Stock.
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Hardcover. Condition: Brand New. 570 pages. 9.25x6.25x1.25 inches. In Stock.
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Condition: new. Questo è un articolo print on demand.
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Condition: new. Questo è un articolo print on demand.
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Moisture Sensitivity of Plastic Packages of IC Devices
Language: English
Published by Springer US Sep 2012, 2012
ISBN 10: 1461426251 ISBN 13: 9781461426257
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. 588 pp. Englisch.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presented in a systematic manner based on lectures and tutorials by the authorsFocused on improved reliability in plastic packagingProvides theory and new industry applicationsMoisture Sensitivity of Plastic Packages of IC Devices provides information o.
