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Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Structural Analysis in Microelectronic and Fiber-Optic Systems : Basic Principles of Engineering Elasticity and Structural Analysis
Language: English
Published by Wiley & Sons, Incorporated, John, 1991
ISBN 10: 0442207719 ISBN 13: 9780442207717
Condition: Good. VOLUME 1. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Volume 2.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
XXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Condition: As New. Unread book in perfect condition.
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Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Condition: New.
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Structural Analysis in Microelectronic and Fiber-Optic Systems: Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 50.43
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
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Condition: New. pp. 436.
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Human-in-the-Loop: Probabilistic Modeling of an Aerospace Mission Outcome
Language: English
Published by Taylor & Francis Ltd, 2021
ISBN 10: 0367781352 ISBN 13: 9780367781354
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Condition: New. pp. lxii + 1460.
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Condition: New. pp. lxii + 1460 Illus.
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Human-in-the-loop : Probabilistic Modeling of an Aerospace Mission Outcome
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Human-in-the-loop : Probabilistic Modeling of an Aerospace Mission Outcome
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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PF. Condition: New.
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Human-in-the-Loop
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 64.14
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New. 1st edition NO-PA16APR2015-KAP.
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Structural Analysis in Microelectronic and Fiber-optic Systems: Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis: Vol 1
Language: English
Published by Springer Netherlands, 2013
ISBN 10: 9401165378 ISBN 13: 9789401165372
Paperback. Condition: Brand New. 436 pages. 8.98x6.06x1.02 inches. In Stock.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language: English
Published by Taylor & Francis Ltd, 2024
ISBN 10: 0367635887 ISBN 13: 9780367635886
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 73.29
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Paperback. Condition: Brand New. 237 pages. 9.25x6.14x0.67 inches. In Stock.
