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Robust Design Microelectronics Assemblies by Wong E H (7 results)
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and . . Series in Electronic and Optical Materials)
Book 88 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsLanguage: English
Published by Woodhead Publishing 2015-06-01, 2015
ISBN 10: 1845695283 ISBN 13: 9781845695286
£ 133.52
£ 15.49 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardcover. Condition: New.
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Hardcover. Condition: Brand New. 1st edition. 482 pages. 9.25x6.25x1.00 inches. In Stock.
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Condition: new. Questo è un articolo print on demand.
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Book 88 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsLanguage: English
Published by Elsevier Science Mai 2015, 2015
ISBN 10: 1845695283 ISBN 13: 9781845695286
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. 482 pp. Englisch.
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Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
