Robust Design Microelectronics Assemblies by Wong E H (7 results)
Language: English
Published by Woodhead Publishing, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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£ 124.61
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by Woodhead Publishing, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by Woodhead Publishing 2015-06-01, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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Hardcover. Condition: New.
Language: English
Published by Woodhead Pub Ltd, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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£ 152.19
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Hardcover. Condition: Brand New. 1st edition. 482 pages. 9.25x6.25x1.00 inches. In Stock.
Language: English
Published by Woodhead Publishing, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
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£ 139.86
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Condition: new. Questo è un articolo print on demand.
Language: English
Published by Elsevier Science Mai 2015, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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£ 157.44
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of t…his important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. 482 pp. Englisch.
Language: English
Published by Elsevier Science, 2015
Series: Woodhead Publishing Series in Electronic and Optical Materials, Book 88 of 203. Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Hardcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 162.86
£ 54.89 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this i…mportant field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
