Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials

Wong, E. H./ Mai, Y. W.

ISBN 10: 1845695283 ISBN 13: 9781845695286
Published by Woodhead Pub Ltd, 2015
Language: English
Condition: New Hardcover

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