Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials) - Hardcover

Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials

Wong, E-H; Mai, Y.-W.

 
9781845695286: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials)
Hardcover
ISBN 10: 1845695283 ISBN 13: 9781845695286
Publisher: Woodhead Publishing, 2015

Synopsis

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

  • Discusses how the reliability of packaging components is a prime concern to electronics manufacturers
  • Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques
  • Includes program files and macros for additional study

"synopsis" may belong to another edition of this title.

About the Author

Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia

"About this title" may belong to another edition of this title.

Publisher
Woodhead Publishing
Publication date
2015
Language
English
ISBN 10 
1845695283
ISBN 13 
9781845695286
Binding
Hardcover
Number of pages
482