Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and . . Series in Electronic and Optical Materials)

Language: English

Published by Woodhead Publishing 2015-06-01, 2015

1845695283 / 9781845695286

Series: Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials

  • Hardcover
  • New
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Title
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and . . Series in Electronic and Optical Materials)
Author
E-H Wong, Y.-W. Mai
Publisher
Woodhead Publishing 2015-06-01
Publication year
2015
Condition
New
Binding
Hardcover
Language
English
ISBN 10
1845695283
ISBN 13
9781845695286
Series
Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials

Chiron Media

Wallingford, United Kingdom

5-star seller

AbeBooks seller since August 2, 2010

Shipping rates from United Kingdom to U.S.A.

Item14 to 21 business days14 to 21 business days
First item£ 15.49£ 15.49
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