Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture

Language: English

Published by Woodhead Publishing, 2015

1845695283 / 9781845695286

Series: Book 88 of 203 - Woodhead Publishing Series in Electronic and Optical Materials

  • Hardcover
  • New
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Title
Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture
Author
Wong, E-H; Mai, Y.-W.
Publisher
Woodhead Publishing
Publication year
2015
Condition
New
Binding
Hardcover
Language
English
ISBN 10
1845695283
ISBN 13
9781845695286
Series
Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials

Romtrade Corp.

STERLING HEIGHTS, MI, U.S.A.

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