Robust Design Of Microelectronics Assemblies Against Mechanical Shock, Temperature And Moisture

Book 88 of 203: Woodhead Publishing Series in Electronic and Optical Materials

Wong, E-H; Mai, Y.-W.

ISBN 10: 1845695283 ISBN 13: 9781845695286
Published by Woodhead Publishing, 2015
Language: English
Condition: New Hardcover

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