Isbn: 9780071848060 - 3d Ic Integration and Packaging (electronics) (12 results)

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  • Language: English

    Published by McGraw Hill, 2015

    0071848061 / 9780071848060

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    Hardcover. Condition: Very Good. 1st Edition. UNUSED BOOK: NO HIGHLIGHTS, NO WRITINGS: The book has a remainder mark at itss edge.: US seller ships from USA.

  • Language: English

    Published by McGraw Hill, 2015

    0071848061 / 9780071848060

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  • Language: English

    Published by McGraw Hill, 2015

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  • Language: English

    Published by McGraw Hill, 2015

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  • Language: English

    Published by McGraw Hill, 2015

    0071848061 / 9780071848060

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  • Language: English

    Published by McGraw Hill, 2015

    0071848061 / 9780071848060

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  • Language: English

    Published by MCGRAW HILL BOOK CO, 2015

    0071848061 / 9780071848060

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    Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications&Uumlber den AutorrnrnnJohn H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977).…

  • Language: English

    Published by The McGraw-Hill Company, 2015

    0071848061 / 9780071848060

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    Condition: New. Print on Demand pp. 512.

  • Language: English

    Published by The McGraw-Hill Company, 2015

    0071848061 / 9780071848060

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    Condition: New. Print on Demand pp. 512.

  • Language: English

    Published by McGraw-Hill Education, 2015

    0071848061 / 9780071848060

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    Buch. Condition: Neu. 3D IC Integration and Packaging | John H. Lau | Buch | Gebunden | Englisch | 2015 | McGraw-Hill Education | EAN 9780071848060 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.

  • Language: English

    Published by The McGraw-Hill Company, 2015

    0071848061 / 9780071848060

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    Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios

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    Condition: New. PRINT ON DEMAND pp. 512.

  • Language: English

    Published by Mcgraw-Hill Education, 2015

    0071848061 / 9780071848060

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    Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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    Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.3D IC Integration and Packaging covers:¿ 3D integration for semiconductor IC packaging¿ Through-silicon vias modeling and testing¿ Stress sensors for thin-wafer handling and strength measurement¿ Package substrate technologies¿ Microbump fabrication, assembly, and reliability¿ 3D Si integration¿ 2.5D/3D IC integration¿ 3D IC integration with passive interposer¿ Thermal management of 2.5D/3D IC integration¿ Embedded 3D hybrid integration¿ 3D LED and IC integration¿ 3D MEMS and IC integration¿ 3D CMOS image sensors and IC integration¿ PoP, chip-to-chip interconnects, and embedded fan-out WLP.…