3D IC Integration and Packaging

Language: English

Published by McGraw Hill, 2015

0071848061 / 9780071848060

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UNUSED BOOK: NO HIGHLIGHTS, NO WRITINGS: The book has a remainder mark at itss edge.: US seller ships from USA.

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Title
3D IC Integration and Packaging
Author
Lau, John H.
Publisher
McGraw Hill
Publication year
2015
Condition
Very good
Binding
Hardcover
Language
English
ISBN 10
0071848061
ISBN 13
9780071848060
Edition
1st Edition
Item weight
1,007 grams
Dimensions
19.56 centimeters width by 24.13 centimeters height by 2.92 centimeters depth

BOOKWEST

Phoenix, AZ, U.S.A.

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AbeBooks seller since December 10, 2022

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