Perkins Andrew E (34 results)

- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 29.74
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Condition: As New. Unread book in perfect condition.

MAX PERKINS, EDITOR OF GENIUS
Berg, A. Scott (Andrew Scott) [author] ; Perkins, Maxwell E. (Maxwell Evarts), 1884-1947 [subject]
Language: English
Published by Thomas Congdon Books, E.P. Dutton, New York, 1978
- Hardcover
Seller: Second Story Books, ABAA, Rockville, MD, U.S.A.Second Story Books, ABAA
Contact seller4-star sellerCondition: Used
£ 29.12
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Hardcover. Octavo, viii, 498 pages. In Good plus condition with a Good dust jacket in Good slipcase. Slipcase in red paper; light shelf wear. Spine is blue and cream with white and black print. Dust jacket has light edge wear, toning to spine. Price unclipped: "$15.00". Boards in blue cloth; slight wear to spine caps, light shelf wear. Illustrated: b&w frontispiece portrait and plates (photographs). NOTE: Shelved in Netdesk Column Z. 1408834. FP New Rockville Stock.…

- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 27.96
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Condition: New.

- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 31.20
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Condition: As New. Unread book in perfect condition.

Language: English
Published by Routledge, 2021
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 56.70
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Condition: As New. Unread book in perfect condition.

Language: English
Published by Routledge, 2021
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 64.89
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Condition: New.

Language: English
Published by Routledge, 2021
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 52.95
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Condition: New.

Language: English
Published by Routledge, 2021
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 56.50
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Condition: As New. Unread book in perfect condition.

- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 93.83
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Condition: New.

- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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£ 84.33
£ 15.49 shippingShips from United Kingdom to U.S.A.Quantity: 10 available
PF. Condition: New.

- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 102.97
£ 1.99 shippingShips within U.S.A.Quantity: 15 available
Condition: New.

- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 95.43
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Condition: New. In English.

- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 107.55
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Condition: As New. Unread book in perfect condition.

- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 106.71
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Condition: New. In English.

- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 103.31
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Condition: New.

- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 105.76
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Condition: As New. Unread book in perfect condition.

- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 97.05
£ 29.69 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries.…

- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 134.69
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Condition: New. pp. 212.

- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 108.67
£ 29.69 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Solder Joint Reliability Prediction for Multiple Environmentswill provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space,and automotive industries.…

- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 129.36
£ 10.00 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 1st edition. 192 pages. 9.25x6.00x0.50 inches. In Stock.

- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 145.90
£ 3.01 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 210.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
£ 92.79
£ 59.38 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Solder Joint Reliability Prediction for Multiple Environments | Andrew E. Perkins (u. a.) | Taschenbuch | xvi | Englisch | 2010 | Springer | EAN 9781441946348 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 167.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 200.12
£ 1.99 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.

- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 83.85
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Condition: new. Questo è un articolo print on demand.

- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 78.62
£ 41.55 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.…

- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 87.71
£ 41.55 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.…

- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 139.03
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 212 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

- Hardcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
£ 93.47
£ 50.89 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 212 pp. Englisch.…