Solder Joint Reliability Prediction for Multiple Environments
Language: English
Published by Springer US, 2010
- Softcover
- New
Condition: New
£ 87.71
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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliabilityDevelops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and powe.
Seller Inventory # 4174967
- Title
- Solder Joint Reliability Prediction for Multiple Environments
- Author
- Andrew E. Perkins|Suresh K. Sitaraman
- Publisher
- Springer US
- Publication year
- 2010
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 1441946349
- ISBN 13
- 9781441946348
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
"Synopsis" may belong to another edition of this title.
From the Back Cover
Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability, including:
A comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability,
Useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling, and power cycling enviroments,
New insight into solder joint reliability testing under multiple environments, including vibration environments,
A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type.
Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder.
"About the title" may belong to another edition of this title.
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