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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127.
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Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127 Illus.
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Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127.
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Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335 (MRS Proceedings)
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New.
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Condition: New. Brand New.
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Advanced Interconnects for ULSI Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 164.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: As New. Unread book in perfect condition.
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Advanced Interconnects for ULSI Technology (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2012
ISBN 10: 0470662549 ISBN 13: 9780470662540
First Edition
Hardcover. Condition: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Dielectric Films for Advanced Microelectronics
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
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Condition: new.
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Advanced Interconnects for ULSI Technology
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 195.45
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Condition: New.
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Dielectric Films for Advanced Microelectronics
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 197.91
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
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Condition: New. Brand new! Please provide a physical shipping address.
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Dielectric Films for Advanced Microelectronics (Wiley Series in Materials for Electronic & Optoelectronic Applications)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 202.71
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: As New. Unread book in perfect condition.
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Advanced Interconnects for ULSI Technology
Language: English
Published by John Wiley and Sons Ltd, 2012
ISBN 10: 0470662549 ISBN 13: 9780470662540
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . .
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Dielectric Films for Advanced Microelectronics
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 216.16
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
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Advanced Interconnects for ULSI Technology (Hardcover)
Language: English
Published by John Wiley & Sons Inc, New York, 2012
ISBN 10: 0470662549 ISBN 13: 9780470662540
First Edition
Hardcover. Condition: new. Hardcover. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirementsLow-k materials: fundamentals, advances and mechanical propertiesConductive layers and barriersIntegration and reliability including mechanical reliability, electromigration and electrical breakdownNew approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Condition: New. Karen Maex, IMEC Fellow, Silicon Process and Device Technology Division, Leuven, Belgium & Professor at Katholieke Universiteit LeuvenMikhail R. Baklanov, Principal Scientist, Silicon Process and Device Technology Division, IMEC, Leuven, BelgiumIMEC is the .
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Condition: New. pp. 508 Illus.
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Advanced Interconnects for ULSI Technology
Language: English
Published by John Wiley and Sons Ltd, 2012
ISBN 10: 0470662549 ISBN 13: 9780470662540
Condition: New. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects. Editor(s): Baklanov, Mikhail R.; Ho, Paul S.; Zschech, Ehrenfried. Num Pages: 606 pages, Illustrations. BIC Classification: TJFD. Category: (P) Professional & Vocational. Dimension: 248 x 171 x 32. Weight in Grams: 1058. . 2012. . . . . Books ship from the US and Ireland.
