Order Total (1 Item Items):
Shipping Destination:
Baklanov M (8 results)
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (8)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (6)
- As New, Fine or Near Fine (No further results match this refinement)
- Very Good or Good (2)
- Fair or Poor (No further results match this refinement)
- As Described (No further results match this refinement)
Binding
Collectible Attributes
- First Edition (No further results match this refinement)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (3)
- Not Print on Demand (8)
Language (2)
Price
- Any Price
- Under £ 20 (No further results match this refinement)
- £ 20 to £ 40 (No further results match this refinement)
- Over £ 40
Free Shipping
Seller Location
Seller Rating
-
MATERIALS, PROCESSES, AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS Â" 2011
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
-
Materials, Processes, and Reliability for Advanced Interconnects
Language: English
Published by Materials Research Society, 2011
ISBN 10: 1605113123 ISBN 13: 9781605113128
Condition: New. pp. ix + 127.
-
Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,400grams, ISBN:9783642002977.
-
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
-
Gebunden. Condition: New. Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over.
-
Gebunden. Condition: New. Karen Maex, IMEC Fellow, Silicon Process and Device Technology Division, Leuven, Belgium & Professor at Katholieke Universiteit LeuvenMikhail R. Baklanov, Principal Scientist, Silicon Process and Device Technology Division, IMEC, Leuven, BelgiumIMEC is the .
-
International EditionADVANCED INTERCONNECTS FOR ULSI TECHNOLOGY (HB 2012)
Language: English
Published by JOHN WILEY (ORIGINAL), 2012
ISBN 10: 0470662549 ISBN 13: 9780470662540
Condition: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
-
URBANISMO RUSO: Hasta finales del siglo XVII (Planificación y desarrollo de ciudades rusas, Leningrado 1953, TEXTO EN RUSO)
Language: Russian
Published by Editorial Estatal de Literatura sobre Construcción y Arquitectura, 1953
Encuadernación de tapa dura. Condition: Bien. Editorial Estatal de Literatura sobre Construcción y Arquitectura, Leningrado, 1953. Texto en ruso. Arquitectura. Urbanismo. Profusamente ilustrado. 214 pp. 30 x 24. Tela editorial tapa dura de editorial ilustrada. Sin subrayados ni anotaciones. Buen estado de conservación.
